Semifinished product and method for producing a light-emitting diode

ABSTRACT

The invention relates to a method and a semifinished product for producing a light-emitting diode including: a flexible supporting material; a first and a second contact area, arranged on the supporting material, for producing electrical connections; a light-emitting diode chip or a holder for a light-emitting diode chip, arranged on the supporting material; a foldable flap, formed into the supporting material, the flap being arranged in such a way that it can be folded towards and/or onto the light-emitting diode chip. Arranged on the foldable flap is at least a first electrical connecting web, which is connected to the first contact area and can be connected to a first terminal of the light-emitting diode chip by folding of the flap.

The present application claims priority from PCT Patent Application No.PCT/EP2011/059907 filed on Jun. 15, 2011, which claims priority fromGerman Patent Application No. DE 10 2010 031 302.5 filed on Jul. 14,2010, the disclosure of which is incorporated herein by reference in itsentirety.

1. FIELD OF THE INVENTION

The invention relates to a semifinished product and to a method forproducing a light-emitting diode.

It is noted that citation or identification of any document in thisapplication is not an admission that such document is available as priorart to the present invention.

In other methods for producing a light-emitting diode, the activeelements of the light-emitting diode, known as light-emitting diodechips or dies or chip or dies, are placed on a wire-like H-shapedelement. An electrical connection is produced between a first terminalof the light-emitting diode chip and an upper end of the H-shapedelement. After that, a second terminal of the light-emitting diode chipis connected to the second upper end of the H-shaped element, forexample by the known gold wire bonding method. The upper end of theH-shaped element with the light-emitting diode chip arranged on it isthen arranged in a lens casting body, which is filled with a castingcompound for producing the lens body. After producing the lens body, theconnecting crosspiece of the H-shaped element is removed in asoldering-like process, in order to eliminate the short-circuit.

To increase the luminous efficiency, reflectors may be used, arrangedaround the light-emitting diode chip before the production of the lensbody.

Since light-emitting diode chips do not radiate in all colours, but emitdiscrete optical wavelengths, for conversion into white light, forexample, it is necessary to change the frequency by means of luminescentmaterials, for example phosphorus. This phosphorus is usually admixedwith the casting compound for producing the lens body.

The method described requires high precision in the positioning of thelight-emitting diode chip on the H-shaped element. Furthermore it isvery laborious to produce the connection between the second terminal ofthe light-emitting diode chip and the second upper end of the H-shapedelement. On account of the complex production method, the productionrate of a light-emitting diode by the known method is limited.

It is noted that in this disclosure and particularly in the claimsand/or paragraphs, terms such as “comprises”, “comprised”, “comprising”and the like can have the meaning attributed to it in. U.S. Patent law;e.g., they can mean “includes”, “included”, “including”, and the like;and that terms such as “consisting essentially of” and “consistsessentially of” have the meaning ascribed to them in U.S. Patent law,e.g., they allow for elements not explicitly recited, but excludeelements that are found in the prior art or that affect a basic or novelcharacteristic of the invention.

It is further noted that the invention does not intend to encompasswithin the scope of the invention any previously disclosed product,process of making the product or method of using the product, whichmeets the written description and enablement requirements of the USPTO(35 U.S.C. 112, first paragraph) or the EPO (Article 83 of the EPC),such that applicant(s) reserve the right to disclaim, and herebydisclose a disclaimer of, any previously described product, method ofmaking the product, or process of using the product.

SUMMARY OF THE INVENTION

The invention is based on the object of providing a simple and quickproduction method for light-emitting diodes.

The object is achieved by a semifinished product for producing alight-emitting diode comprising a flexible supporting material, a firstand a second contact area, arranged on the supporting material, forproducing electrical connections, a light-emitting diode chip or aholder for a light-emitting diode chip, arranged on the supportingmaterial, a foldable flap, formed into the supporting material, the flapbeing arranged in such a way that it can be folded towards and/or ontothe light-emitting diode chip, there being arranged on the foldable flapat least a first electrical connecting web, which is connected to thefirst contact area and can be connected to a first terminal of thelight-emitting diode chip by folding of the flap.

The use of a semifinished product according to the invention in theproduction of a light-emitting diode has the advantage that the foldableflap which is formed into the supporting material and on which there isarranged a first electrical connecting web, which is connected to thefirst contact area and can be connected to a first terminal of thelight-emitting diode chip by folding of the flap, makes it possible toproduce an electrically conductive connection between a contact area ofthe semifinished product and a terminal of the light-emitting diode chipsimply and quickly. As a result, the rate of the process of producingthe light-emitting diode is significantly improved.

According to an exemplary embodiment of the invention, the secondcontact area is connected to a second terminal of the light-emittingdiode chip by way of a second electrical connecting web. Theelectrically conductive connection between the second contact area andthe second terminal of the light-emitting diode chip is produced whenthe light-emitting diode chip is applied to the semifinished product.Consequently, in the subsequent process of producing the light-emittingdiode, only an electrically conductive connection between the firstcontact area and the first terminal of the light-emitting diode chip hasto be produced.

According to an alternative embodiment of the invention, on the foldableflap there is arranged a second electrical connecting web, which isconnected to the second contact area and can be connected to the secondterminal of the light-emitting diode chip by folding of the flap. It isconsequently possible in one production step to produce the electricallyconductive connections between the first contact area and the firstterminal of the light-emitting diode chip and between the second contactarea and the second terminal of the light-emitting diode chip, wherebythe production rate of a light-emitting diode is further improved.

With both connecting webs arranged on the foldable flap, the flexiblesupporting material is expediently essentially transparent in the regionof the holder for the light-emitting diode chip with respect to theradiation emitted by the light-emitting diode chip, so that theradiation emitted by the light-emitting diode chip is radiated throughthe semifinished product and the connecting webs are folded onto therear side of the light-emitting diode chip by means of the flap.

The underlying object of the invention is also achieved by asemifinished product for producing a light-emitting diode comprising aflexible supporting material, a first and a second contact area,arranged on the supporting material, for producing electricalconnections, a first and a second electrical connecting web on thesupporting material, which webs are respectively connected to the firstand second contact areas, a foldable flap, formed into the supportingmaterial, a light-emitting diode chip, arranged on the flap, or a holderfor a light-emitting diode chip, arranged on the flap, the flap and thefirst and second connecting webs being arranged in such a way that afirst and a second terminal of the light-emitting diode chip arerespectively connected to the first and second connecting webs byfolding of the flap. This achieves the effect that, when the flap isfolded, the first and second terminals of the light-emitting diode chipare respectively connected in an electrically conductive manner to thefirst and second connecting webs. Since the positions of thelight-emitting diode chip and of the first and second connecting websare predetermined, a simple and quick connection between the terminalsof the light-emitting diode chip and the contact areas of thesemifinished product can be produced in this way.

After the folding, the flap of one of the semifinished productsdescribed above is expediently fixed to the light-emitting diode chip byan adhesive.

According to an advantageous embodiment of the invention, the adhesivecontains phosphorus compounds, in order to convert the frequency of theradiation radiated by the light-emitting diode chip. Sincelight-emitting diodes emit discrete optical wavelengths and do notradiate in all colours, for the conversion of the radiation given off itis desirable to change the frequency, for example by means ofphosphorus. This has the advantage that the phosphorus compounds are notintegrated in the lens body, as known from the prior art, but merely inthe adhesive layer between the flap and the light-emitting diode chip,thereby reducing the amount of phosphorus compounds required.

The flap of one of the semifinished products described above isexpediently at least partially transparent with respect to the radiationemitted by the light-emitting diode chip.

According to a further advantageous configuration of the invention, theflap contains phosphorus compounds, in order to convert the frequency ofthe radiation radiated by the light-emitting diode chip. This allows thefrequency of the radiation radiated by the light-emitting diode chip tobe converted to the desired frequency in a simple way.

A reflector for the radiation radiated by the light-emitting diode chipis advantageously arranged on the flap, for example by placement, vapourdeposition or sputtering of aluminium. This increases the luminousefficiency of the light-emitting diode. It also avoids an additionalmethod step in which an additional reflector is arranged in the vicinityof the light-emitting diode chip.

The first and second contact areas are expediently respectivelyconnected to a contact pin. These contact pins serve for producing anelectrically conductive connection to an external electronic circuit, inwhich the light-emitting diode is fitted. For example, for this purposethe contact pins are arranged approximately parallel to one another at aspecific distance from one another, for example at a distance of 3 mm or5 mm.

According to an alternative embodiment of the invention, the firstand/or second contact area arranged on the supporting material can bedeformed into a contact pin, preferably by means of folding linesprovided on the supporting material The folding of the supportingmaterial along the folding lines has the effect that the first and/orsecond contact area arranged on the supporting material is deformed intoa contact pin, thereby avoiding the connection of the first and/orsecond contact area to a separate contact pin.

According to a preferred embodiment of the invention, one of thesemifinished products described above comprises multiple light-emittingdiode chips and/or holders for light-emitting diode chips, preferablytwo to eight light-emitting diode chips and/or holders forlight-emitting diode chips. The arrangement of multiple light-emittingdiode chips on a semifinished product according to the invention allowsthe intensity of the radiation that is given off to be increased. It isalso possible to convert the radiation that is given off by the multiplelight-emitting diode chips differently by the use of differentphosphorus compounds, so that different colours can be radiated, or tocombine light-emitting diode chips that emit different colours, such asfor example in the case of so-called RGB LEDs.

If the semifinished product has multiple light-emitting diode chipsand/or holders for light-emitting diode chips, the semifinished productmay likewise comprise multiple foldable flaps formed into the supportingmaterial, the flaps being arranged in such a way that they can berespectively folded towards and/or onto one of the light-emitting diodechips. This is particularly advantageous if the radiation given off bythe individual light-emitting diode chips is intended to be converted bymeans of phosphorus compounds in the adhesive between the flap and thelight-emitting diode chip or within the flap.

The object underlying the invention is also achieved by a method forproducing a light-emitting diode comprising the steps of: providing oneof the semifinished products described above, folding the flap, possiblyapplying the contact pins to the contact areas, arranging thesemifinished product in a lens casting body and filling the lens castingbody with a casting compound for producing a lens body. The methodaccording to the invention has the advantage that the production of theelectrical connection between the light-emitting diode chip and thecontact areas of the semifinished product is produced by simple foldingof the flap, and consequently avoids using the laborious gold wirebonding method for producing the electrically conductive connectionbetween the light-emitting diode chip and the contact areas of thesemifinished product.

Before the folding of the flap, an adhesive is expediently applied tothe flap or the light-emitting diode chip, so that the folded flap isfixed.

According to a preferred embodiment of the invention, the semifinishedproduct is deformed in such a way that the contact pins connected to thecontact areas are arranged approximately parallel to one another at aspecific distance from one another, preferably 3 mm or 5 mm (or 1/10″ or2/10″). Since the semifinished product consists of a flexible supportingmaterial, it can be easily deformed into the desired form, which makesit easier for the light-emitting diode produced according to the methodto be fitted into an external electronic circuit.

For the purposes of the invention, flexible means here that thesupporting material can be bent at least by 90° without beingpermanently damaged.

The contact pins are expediently soldered or adhesively bondedconductively to the contact areas.

Alternatively, the contact pins are connected to the contact areasmechanically, for example by means of a frictional connection and/or bydeforming contact regions on the contact pins.

According to a further preferred embodiment of the invention, a sheethas multiple semifinished products described above, the multiplesemifinished products being punched out in a further method step, forexample before the contact pins are applied to the contact areas, beforethe semifinished product is arranged in a lens casting body or beforethe semifinished products are deformed. This allows multiplelight-emitting diodes to be produced simultaneously, whereby theproduction rate is further increased.

For the purposes of the invention, a sheet may also be a web ofmaterial, which may possibly be wound onto one or more rolls.

According to an advantageous configuration of the invention, thelight-emitting diode chip is arranged in the holder for thelight-emitting diode chip by means of the following method: applying anadhesive-repellent composition to at least a sub-surface of thesemifinished product that is not the holder for the light-emitting diodechip, curing the adhesive-repellent composition, applying an adhesivecomposition to the holder for the light-emitting diode chip, thesub-surface of the semifinished product that is provided with theadhesive-repellent composition enclosing and bordering the holder forthe light-emitting diode chip that is provided with the adhesivecomposition, and applying the light-emitting diode chip to the adhesivecomposition located in the holder for the light-emitting diode chip, theadhesive-repellent composition being a radiation-curing nonstick coatingcompound. An adhesive composition is understood in the present case asessentially meaning a composition of a nonmetallic substance that iscapable of connecting the semifinished product and the light-emittingdiode chip by surface-area bonding (adhesion) and internal strength(cohesion). More preferably, the adhesive composition is curable, i.e.it can be crosslinked by suitable measures that arc known per se to aperson skilled in the art, resulting in a solid mass that immobilizesthe light-emitting diode chip on the semifinished product.

An adhesive-repellent composition is not spontaneously miscible with theadhesive composition and, in contact with it, leads to an increase inthe contact angle (wetting angle) between the semifinished product andthe adhesive composition. An adhesive-repellent composition of this typeis also referred to as a “nonstick coating compound”. Theadhesive-repellent composition used according to the invention is aradiation-curing nonstick coating compound, i.e. a nonstick coatingcompound which has crosslinked or polymerizable radicals that arecurable by electromagnetic radiation, in particular UV light or electronradiation. The curing of the adhesive-repellent composition consequentlytakes place by the composition that is applied to the semifinishedproduct being irradiated with electromagnetic radiation, in particularUV light or electron radiation, until at least partial curing of thecomposition is achieved, whereby a high pattern fidelity is achieved.

In the case of the method according to the invention, the adhesivecomposition and the adhesive-repellent composition are applied to thesemifinished product in such a way that, after it has cured, theadhesive-repellent composition encloses and borders the adhesivecomposition once the two compositions have been applied, i.e. the curedadhesive-repellent composition surrounds the adhesive compositionlocated on the semifinished product in such a way that, essentially atevery location at which the contact angle forms between the semifinishedproduct and the adhesive composition, there is also a phase boundary ofthe adhesive composition and the cured adhesive-repellent composition.

The invention also relates to a light-emitting diode containing at leastone light-emitting diode chip that has been produced by the methoddescribed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a semifinished product according to the invention;

FIG. 2 shows the semifinished product as shown in FIG. 1 after foldingof the flap;

FIG. 3 shows the semifinished product as shown in FIG. 2 with appliedcontact pins;

FIG. 4 shows the semifinished product as shown in FIG. 3 after adeformation of the semifinished product;

FIG. 5 shows a light-emitting diode produced by the method according tothe invention;

FIG. 6 shows an alternative connection according to the inventionbetween the first contact area and the second contact area of thesemifinished product by connecting pins;

FIG. 7 shows a semifinished product according to the invention afterproduction of the frictional connection;

FIG. 8 shows a semifinished product according to the invention afterbending over of the contact pins;

FIG. 9 shows an alternative light-emitting diode according to theinvention,

FIG. 10 shows an alternative semifinished product according to theinvention; and

FIG. 11 shows a further semifinished product according to the invention.

DETAILED DESCRIPTION OF EMBODIMENTS

It is to be understood that the figures and descriptions of the presentinvention have been simplified to illustrate elements that are relevantfor a clear understanding of the present invention, while eliminating,for purposes of clarity, many other elements which are conventional inthis art. Those of ordinary skill in the art will recognize that otherelements arc desirable for implementing the present invention. However,because such elements are well known in the art, and because they do notfacilitate a better understanding of the present invention, a discussionof such elements is not provided herein.

The present invention will now be described in detail on the basis ofexemplary embodiments.

In FIG. 1, a semifinished product 1 for producing a light-emitting diode2 is represented. The semifinished product 1 comprises a flexiblesupporting material 3, a first and a second contact area 4, 5, arrangedon the supporting material 3, for producing electrical connections, alight-emitting diode chip 6, arranged on the supporting material 3, afoldable flap 7, formed into the supporting material 3, the flap 7 beingarranged in such a way that it can be folded onto or against thelight-emitting diode chip 6, there being arranged on the foldable flap 7at least a first electrical connecting web 8, which is electricallyconnected to the first contact area 4 and can be connected to a firstterminal of the light-emitting diode chip by folding of the flap 7. Thesecond contact area 5 is electrically connected to a second terminal ofthe light-emitting diode chip by way of a second electrical connectingweb 9.

A reflector (not represented) for the radiation given off by thelight-emitting diode chip 6 is arranged on the flap 7 by vapourdeposition of aluminium.

A method according to the invention for producing a light-emitting diode2 on the basis of a semifinished product 1 as shown in FIG. 1 isexplained in more detail below with reference to FIGS. 2 to 5.

During the method according to the invention, an adhesive is applied tothe flap 7 or the light-emitting diode chip 6. The adhesive preferablycontains phosphorus compounds, in order to convert the frequency of theradiation given off by the light-emitting diode chip 6 to adapt theradiation given off by the light-emitting diode.

After that, the flap 7 is folded onto the light-emitting diode 6. Bymeans of the adhesive applied, the flap 7 is fixed on the light-emittingdiode chip 6 after the folding. The flap 7 is at least partiallytransparent with respect to the radiation emitted by the light-emittingdiode chip 6. The semifinished product 1 after folding of the flap 7onto the light-emitting diode chip 6 is represented in FIG. 2.

After that, the first contact area 4 and the second contact area 5 arerespectively connected to a contact pin 10, 11, for example bysoldering. A semifinished product 1 with contact pins 10, 11 isrepresented in FIG. 3. Subsequently, the semifinished product 1 isdeformed in such a way that the contact pins 10, 11 connected to thecontact areas 4, 5 are arranged approximately parallel to one another ata specific distance from one another. The distance between the contactpins 10, 11 is preferably 3 mm or 5 mm or they are adapted to thecustomary pitches of 1/10″ or 2/10″.

In FIG. 4, a semifinished product 1 during the deformation isrepresented.

The semifinished product 1 deformed in this way is arranged in a lenscasting body, which is subsequently filled with a casting compound forproducing a lens body 12. After the curing of the casting compound, thefinished light-emitting diode 2 can be removed from the lens castingbody.

A light-emitting diode 2 produced by the method according to theinvention is represented in FIG. 5.

In FIGS. 6-9, an alternative connection between the first contact area 4and the second contact area 5 of the semifinished product by connectingpins 10, 11 is represented. Contact pins 10, 11 respectively have arecess 13, which is formed in such a way that a frictional connection isrespectively produced between the contact pins 10, 11 and the first andsecond contact areas 4, 5 of the semifinished product. A semifinishedproduct 1 after production of the frictional connection is representedin FIG. 7.

In order to increase further the connection between the contact pins 10,11 and the semifinished product 1, the contact pins 10, 11 are bent overin the region of the contact areas 4, 5 and the recesses 13, asrepresented in FIG. 8.

A resultant light-emitting diode 2 is represented in FIG. 9.

In FIG. 10, an alternative semifinished product 1 according to theinvention for producing a light-emitting diode 2 is represented. Thesemifinished product 1 comprises a flexible supporting material 3, afirst and a second contact area 4, 5, arranged on the supportingmaterial 3, for producing electrical connections, a light-emitting diodechip 6, arranged on the supporting material, and also a foldable flap 7,formed into the supporting material 3. The flap is arranged in such away that it can be folded onto or against the light-emitting diode chip6, there being arranged on the foldable flap 7 at least a firstelectrical connecting web 8, which is electrically connected to thefirst contact area 4 and can be connected to a first terminal of thelight-emitting diode chip 6 by folding of the flap 7. The second contactarea 5 is electrically connected to a second terminal of thelight-emitting diode chip 6 by way of a second electrical connecting web9. The first and second contact areas 4, 5, arranged on the supportingmaterial 3, can be respectively deformed into a contact pin 10, 11. Byrespective folding of the first and second contact areas 4, 5, arrangedon the supporting material 3, along folding lines 14, a contact pin 10,11 for producing electrical connections is respectively obtained. Thefolded contact areas 4, 5 are expediently fixed in the folded positionby means of an adhesive.

To identify the terminals of the light-emitting diode chip 6, it ispossible for example for one of the contact pins 10, 11 to be madeshorter.

The semifinished product 1 for producing a light-emitting diode 2 asshown in FIG. 11 differs from the semifinished product as shown in FIG.10 in that merely one folding line 14 is provided, the width of the partto be folded corresponding essentially to the width of the resultantcontact pin 10, 11. An advantage of this is that merely one foldingoperation has to be carried out.

While this invention has been described in conjunction with the specificembodiments outlined above, it is evident that many alternatives,modifications, and variations will be apparent to those skilled in theart. Accordingly, the preferred embodiments of the invention as setforth above are intended to be illustrative, not limiting. Variouschanges may be made without departing from the spirit and scope of theinventions as defined in the following claims.

LIST OF DESIGNATIONS

1—semifinished product

2—light-emitting diode

3—supporting material

4—first contact area

5—second contact area

6—light-emitting diode chip

7—flap

8—first electrical connecting web

9—second electrical connecting web

10—contact pin

11—contact pin

12—lens body

13—recess

14—folding line

1. A semifinished product for producing a light-emitting diodecomprising: a flexible supporting material; a first and a second contactarea, arranged on the supporting material, configured to produceelectrical connections; a light-emitting diode chip or a holder for alight-emitting diode chip, arranged on the supporting material; afoldable flap, formed into the supporting material, the flap beingarranged in such a way that it is foldable towards and/or onto thelight-emitting diode chip; and at least a first electrical connectingweb, arranged on the foldable flap, which is connected to the firstcontact area and is configured to be connected to a first terminal ofthe light-emitting diode chip by folding of the flap.
 2. Thesemifinished product according to claim 1, wherein the second contactarea is connected to a second terminal of the light-emitting diode chipby way of a second electrical connecting web.
 3. The semifinishedproduct according to claim 1, further comprising: a second electricalconnecting web, arranged on the foldable flap, which is connected to thesecond contact area and is configured to be connected to a secondterminal of the light-emitting diode chip by folding of the flap.
 4. Asemifinished product for producing a light-emitting diode comprising: aflexible supporting material; a first and a second contact area,arranged on the supporting material, configured to produce electricalconnections; a first and a second electrical connecting web arranged onthe supporting material, the electrical connecting webs beingrespectively connected to the first and second contact areas; a foldableflap, formed into the supporting material; and a light-emitting diodechip, arranged on the flap, or a holder for a light-emitting diode chip,arranged on the flap; wherein the flap and the first and secondconnecting webs are arranged in such a way that a first and a secondterminal of the light-emitting diode chip are respectively connected tothe first and second connecting webs by folding of the flap.
 5. Thesemifinished product according to one of claims 1 and 4; wherein theflap is fixed on the light-emitting diode chip by an adhesive after thefolding.
 6. The semifinished product according to claim 5; wherein theadhesive contains phosphorus compounds, in order to convert thefrequency of the radiation radiated by the light-emitting diode chip. 7.The semifinished product according to one of claims 1 and 4; wherein theflap is at least partially transparent with respect to the radiationemitted by the light-emitting diode chip.
 8. The semifinished productaccording to one of claims 1 and 4; wherein the flap contains phosphoruscompounds, in order to convert the frequency of the radiation radiatedby the light-emitting diode chip.
 9. The semifinished product accordingto one of claims 1 and 4, further comprising: a reflector, configured toreflect the radiation radiated by the light-emitting diode chip, whichis arranged on the flap.
 10. The semifinished product according to oneof claims 1 and 4; wherein the first and second contact areas arerespectively connected to a contact pin.
 11. The semifinished productaccording to one of claims 1 and 4; wherein the first and/or secondcontact area, arranged on the supporting material are configured to bedeformed into a contact pin.
 12. The semifinished product according toone of claims 1 and 4, further comprising: multiple light-emitting diodechips and/or holders for light-emitting diode chips.
 13. Thesemifinished product according to claim 12, further comprising; multiplefoldable flaps, formed into the supporting material, the flaps beingarranged in such a way that they can be respectively folded towardsand/or onto one of the light-emitting diode chips.
 14. A method forproducing a light-emitting diode, comprising the steps of: providing asemifinished product according to one of claims 1 and 4; folding theflap; optionally applying the contact pins to the contact areasarranging the semifinished product in a lens casting body; and fillingthe lens casting body with a casting compound for producing a lens body.15. The method according to claim 14; wherein an adhesive is applied tothe flap or the light-emitting diode chip.
 16. The method according toclaim 14; wherein the semifinished product being is deformed in such away that the contact pins connected to the contact areas are arrangedapproximately parallel to one another at a specific distance from oneanother, preferably 3 mm or 5 mm.
 17. The method according to claim 14;wherein the contact pins are soldered to the contact areas.
 18. Themethod according to claim 14; wherein the contact pins are connected tothe contact areas electrically and mechanically.
 19. The methodaccording t0 claim 14, further comprising: providing a sheet havingmultiple semifinished products according to one of claims 1 and 4, bypunching out the multiple semifinished products.
 20. The methodaccording to claim 14, further comprising: arranging the light-emittingdiode chip in the holder for the light-emitting diode chip by means ofthe following method: applying an adhesive-repellent composition to atleast a sub-surface of the semifinished product, which surrounds theholder for the light-emitting diode chip; curing the adhesive-repellentcomposition; applying an adhesive composition to the holder for thelight-emitting diode chip; and applying the light-emitting diode chipthe adhesive composition located in the holder for the light-emittingdiode chip, the adhesive-repellent composition being a radiation-curingnonstick coating compound; wherein the sub-surface of the semifinishedproduct that is provided with the adhesive-repellent compositionencloses and boarders the holder for the light-emitting diode chip thatis provided with the adhesive composition.
 21. Light-emitting diodecomprising: at least one light-emitting diode chip, that is produced bythe method according to claim 14.